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Basic information


updated on March 18, 2019

Heat countermeasure through infrared wavelength conversion
A heat dissipation measure developed in response to size reductions, increased thinness and resinification of electronic equipment

Okitsumo Incorporated

Project name Development of a new heat sink type heat dissipation material
Target downstream fields Automobile、Other
Response to the needs of downstream companies High function (improved precision / performance)
Mass reduction (size / weight reduction)
Specific numerical values relating to the above needs 10% decrease in temperature of the heating source.
Prevention of heat spots.
Project implementation period 2010~2012
Commercialization status Undergoing supplementary research (Project undergoing research toward completion)
Target materials Aluminum

Project details

Project background
The trend toward increasing integration and density of electronic parts is progressing in the information household appliance market, due to the advance of information technology and improved product functionality. This trend is leading to an increasing need for forming technology for new materials that can address the heat generated whenever smaller and more precise electronic parts operate. There is a particular need for heat dissipating measures for mobile devices and such like, in response to size reductions, increased thinness and resinification.
Points of R&D
With electronic equipment getting smaller and smaller, thinner and thinner and employing more and more resin materials, conventional heat dissipation methods such as fans and large heat sinks have become increasingly difficult to use, and problems such as increasing heat source temperatures and hot spots on housing surfaces have arisen. These problems have been solved by the development of our "new heat sink type heat dissipation material", a sheet type infrared wavelength-selective emitter.
Specific R&D results
With regard to dissipating heat from a thin sealed resin housing, we thought it was important to secure a new heat dissipation route besides air, as the air inside the housing is isolated from the air outside. With the above in mind, we developed a passive cooling method that dissipates heat efficiently, by attaching to the heat source a heat dissipating material in the form of a sheet type aluminum material with a periodic microcavity structure, and thereby making the resin housing transparent to infrared rays by using selective wavelength heat radiation from the heat source.
Anticipated fields / products etc. to which this technology may be applied in the future
For use as a heat dissipation measure in information household appliances (in particular mobile equipment etc.) which use sealed resin housings.

Work toward commercialization

Activities related to intellectual property and publicity Patent granted.
Future outlook We have already completed the manufacture of prototypes and performance evaluations, and are currently discussing manufacturing conditions to achieve optimal manufacturing costs, as we need to adjust the production cost of the prototypes in order to be able to commercialize.
Level of achievement based on the original goal, and new challenges Although our initial goal has nearly been achieved, in order to be able to commercialize, we must continue to work on the challenge of optimizing production costs.

System of R&D

Organization managing the project Mie Industry and Enterprise Support Center
Certified business operators Okitsumo Incorporated
Institutions conducting the research Okitsumo Incorporated Tohoku University
Advisers "Kisco Ltd. Tsuchiya Co., Ltd."

Promotion comments

We are a company which manufactures and sells heat resistant paints. This project represents a different approach inasmuch as we are controlling heat through surface modification, and we view it as something which will open up new areas of product development. Also, this new sink type heat dissipation material is an entirely new technology that uses selective wavelength heat dissipation. We believe that we will be able to provide a new heat dissipation method for information household appliances and other kinds of electronic equipment.

Corporate information

Company name Okitsumo Incorporated
(Corporate Number:7190001009313)
Address 1109-7 Shibade, Kuramochi-cho, Nabari-shi, Mie-ken 518-0751, JAPAN
Phone number +81-0595-63-9095
Number of employees 156(male  120,female  36)
Capital 99.81 million yen
Business category Chemical industry
Business content Manufacture and sale of heat resistant paints, fluororesin paints and functional coatings
URL http://www.okitsumo.co.jp/
Production base area Domestic location:1109-7 Shibade, Kuramochi-cho, Nabari-shi, Mie-ken
Overseas location:Overseas location: 304 Industrial Park, 220 Moo7, Tha Tum District,
Simahaphut Prachinburi 25140,Thailand
No.18 Shichong Road, Zhongshan Torch Hi-Industrial Development Zone,
Zhongshan, Guangdong P.R.C.
Overseas production response available  Available areas:Thailand, China
Department handling inquiries for this project Engineering Group, Coating Business Department

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